职位描述
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Development of highly reliable electronic assemblies and process for Printed Circuit Board Assemblies (PCBA).
Focus on SMT, press-fit, IDC (internal defect cost) reduction, etc.
Job Responsibilities
- Responsibility for new and improved technologies, rework processes
- Technical support of local
工作地点
地址:苏州吴中区苏州苏州园区工业园区长阳街368号(博世西门)
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职位发布者
HR
博世汽车部件(苏州)有限公司
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汽车·摩托车
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1000人以上
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股份制企业
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中新苏州工业园区苏虹西路126号