Summary:

Coordinate internal resources management Sub-con to provide power module package/assembly total solutions; include but not limited to module design review, Sub-con assembly process risk assessment, schedule and track NPI activities, mass production readiness review, yield continuous improvement etc.

作为窗口协调内部资源对代工厂对于电源模块封装/制造整体解决方案管理；包括但不限于模块设计审查、技术风险评估、新产品导入进度追踪、量产准备、良率持续提升，等等.

RESPONSIBILITIES:

1. Create project milestones of Sub-con, ensuring alignment with product line needs/priorities, and securing stakeholder buy-in;

创建代工厂的项目里程碑，确保与产品线需求/优先级保持一致，并确保利益相关者的认同。

2.Coordinate the assembly engineer and Sub-con Eng.team do DFM/TRA review of power module designs;

与工艺研发工程师和代工厂工程团队合作对于电源模块设计的DFM/TRA进行审查；

3.Co-Work with design team, assembly house, SMT site, material vendor to develop and qualify on new materials and new assembly processes;

与设计团队、封装厂、SMT 现场、材料供应商合作，开发和导入新材料和新的封装工艺;

4.Coordinate with internal team to identify the module package related issues, addresses the root cause and find the solution

通过协调内部资源分析电源模块相关问题，解决根本原因并找到解决方案;

5.Sum up the experience of module package design,SMT process and maintain the design rule;

总结模块封装设计、SMT工艺和维护设计规则的经验;

6.Handling internal or end customer complaints which caused by sub-con

处理因代工厂导致的内部或者终端客户客诉

7.Drive Sub-con to pass the audit based on internal or end customer requirements

推动代工厂按照内部或者终端客户要求通过审核

8.Perform other assigned tasks as needed;

领导安排的其他工作;

REQUIREMENTS:

1.Hands on Eng. or project management experience on SMT or OSAT factory

具有在 SMT 或 IC 封装厂工程或者项目管理工作经验

2.Good knowledge of SMT/Underfill/Mold/Laser marking/Singulation/process
experience

具备一定的SMT、底部填充、塑封、激光打印、分板工艺经验;

3.Experience in power module process development or project management

具有电源模块工艺开发或者项目管理经验

4.Good communication skills with cross-function team and Sub-con

良好的公司内部跨部门和代工厂沟通技巧

5.Good command of English in both spoken and written

良好的英语口语和书面表达能力

6.Bachelor's or master's degree with 5 years project management experience.

本科或者硕士学历，5年以上项目管理经验。